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 Post subject: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 15:56 
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Joined: November 14th, 2016, 17:03
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Location: usa fl
Hello,

I'm wondering what everyone is using when reballing BGA Chips.

I have been having a hard time finding direct heat stencils or even a jig with stencils that match the common BGA chips we work with on a daily basis.

Currently I have some universal ones I have been using but its much more time consuming then using a stencil with the exact pattern of the chip.

Would love to hear from everyone how they go about doing there reballs or what equipment they use.

Any recommendations or tips are much appreciated.


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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 17:10 
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Joined: October 24th, 2009, 15:22
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Location: Poland
You can buy stencil for direct heating on ebay without problem. What chips do you want to reball? Laptop chips?
You need good hot air for that. PT or Ayoue is not good for this purpose. Buy better one.

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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 18:20 
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Specifically Nand chips from USB drives and SSDs. For example BGA152 BGA52.etc I can provide some pictures to show you. I've checked ebay and Google a couple times was unsuccessful finding any.


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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 18:24 
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Why you need reball it? Adapters for this chip not need balls.

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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 18:28 
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Joined: November 14th, 2016, 17:03
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Mainly for when doing swap with the chips to a donor or if solder connection requires a reball to correct. What adapters are you referring too.


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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 18:30 
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Any, VNR, PC3K, SC not need balls.

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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 18:37 
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Joined: November 14th, 2016, 17:03
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Yes I have both of those. But sometimes its easier to repair the connection then go through the process of building a image or if its a SanDisk for example and xor requires a donor and its unavailable and the only issue is a solder connection. Have you found any stencils for these?


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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 19:12 
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Joined: October 24th, 2009, 15:22
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To be onest I never reball the chip. Just no need, solder connection problem under ball is very rare. But even if I need i do not reball the chip, just put some tin on chip pads and PCB pads, than use flux and hot air. Chip snaps to correct position when tip melts.

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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 21:03 
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Joined: November 14th, 2016, 17:03
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Alright ill give it a shot, thanks for the tip.


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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 16th, 2016, 21:23 
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Joined: July 30th, 2012, 3:37
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Location: Fairfield, CT USA
Woo hoo, I created a video a few months ago on just this :-)
https://vimeo.com/183078326

Yes, I know, very random.. I shot it for one of my clients who said they weren't able to reball.. 1st video..

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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 17th, 2016, 12:34 
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Joined: November 14th, 2016, 17:03
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Thanks for that video, I will definitely have to try that.

What flux are you using when you do your reballs?

Also I watched a video last night of reballing with soldering paste instead of the balls, looks like it could help save some time also.

Have you had any experience using soldering paste for reballs?
https://www.youtube.com/watch?v=zj9RXw6D1H8


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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 17th, 2016, 17:29 
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Joined: July 30th, 2012, 3:37
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Location: Fairfield, CT USA
mattthecomputerman wrote:
What flux are you using when you do your reballs?

Same flux he uses:
https://mailin.repair/amtech-nc-559-v2-30-cc-16160.html

mattthecomputerman wrote:
Have you had any experience using soldering paste for reballs?

Yes, I can't make it work, everything comes out as a blob, maybe it's the jig, stencils, solder paste, heating method.. IDK Louis says solder balls popup during reflow but I've never had that issue. When I used aluminum stencils they would bow when heated. That's why I use stainless steel, it's made for hot air, not IR Rework. For me using solder balls takes 3min-5min, I can also control how much solder is on the pads.

However you can make it work, that's what is important. it actually took me a lot of trial and error before I found a solution which worked for me. Flux and Stainless Steel stencils were the most important.

Maybe I'm was using shit paste but it seems like it dries out after 3-6 months. Like the flux breaks away..

mattthecomputerman wrote:
Also I watched a video last night of reballing with soldering paste instead of the balls, looks like it could help save some time also.
https://www.youtube.com/watch?v=zj9RXw6D1H8

Louis is helarious, I love his videos.

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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 20th, 2016, 4:50 
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jeremyb wrote:
Woo hoo, I created a video a few months ago on just this :-)
https://vimeo.com/183078326

Yes, I know, very random.. I shot it for one of my clients who said they weren't able to reball.. 1st video..


Jeremyb ,
You are so softspoken man .The end result was good ,What flux were you using and have to tried solder paste in the same setup like louis

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 Post subject: Re: Reballing Equip for BGA Chips
PostPosted: November 20th, 2016, 15:43 
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Joined: July 30th, 2012, 3:37
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Location: Fairfield, CT USA
Amarbir[CDR-Labs] wrote:
jeremyb wrote:
Woo hoo, I created a video a few months ago on just this :-)
https://vimeo.com/183078326

Yes, I know, very random.. I shot it for one of my clients who said they weren't able to reball.. 1st video..


Jeremyb ,
You are so softspoken man .The end result was good ,What flux were you using and have to tried solder paste in the same setup like louis


Flux:
https://mailin.repair/amtech-nc-559-v2-30-cc-16160.html

I have tried and failed with solder paste, it was like I could not get an air tight seal, underneath all the solder paste would create large blobs of solder. Surely I am messing up somewhere but my method works for me, his method works for him. The result is the same.

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