HaQue wrote:
usually call it a MCP, Multi chip package. Not sur exactly the terminology for these. as soon as I can get one I will start looking into it. I have multiple surface RT, 3 and 4 Pro's but no 5's. trying to buy a second hand one. I would think yes, but some drilling to expose bonds might be required.. or not depending on if chip maker needed nand exposed to pads or not.
In alot of MCP, some pads might be dual purpose.
May be the same as a Galaxy S5 and S6? They have UFS chips that sits on top of the controller. That chip can be read in a programmer as they are commercially available through Dediprog. If they are assembled the same, the NAND is soldered and glued to the bottom CPU, which is balled on both sides. If I get that far I will let you know.