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 Post subject: Surface Pro 5 NAND Question
PostPosted: August 1st, 2018, 20:15 
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Joined: June 11th, 2013, 17:01
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Location: USA
Anyone tried a chip off on a Surface Pro 5, or know if its even worth it?
I have attached a picture of the chip and the space for an additional chip which details the pinout.
This chip is also PCIe.
I am hoping this is an obvious mobo issue so we can extract the data that way, but we will see.


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Surface Pro 5.JPG
Surface Pro 5.JPG [ 203.82 KiB | Viewed 806 times ]

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 Post subject: Re: Surface Pro 5 NAND Question
PostPosted: August 1st, 2018, 21:47 
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Hi, you should search forum mate!! :-)

http://forum.hddguru.com/viewtopic.php?f=10&t=37085


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 Post subject: Re: Surface Pro 5 NAND Question
PostPosted: August 3rd, 2018, 2:01 
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There are 2 date codes and 2 part numbers on that chip. Is it a "stacked" device? That is, would it be possible to separate the NAND from the controller???

    K90KGY8S0E-4000 -- week 16, 2017 -- NAND flash ???
    KUS020203M-B000 -- week 19, 2017 -- controller (SSD) ???

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 Post subject: Re: Surface Pro 5 NAND Question
PostPosted: August 3rd, 2018, 2:56 
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usually call it a MCP, Multi chip package. Not sur exactly the terminology for these. as soon as I can get one I will start looking into it. I have multiple surface RT, 3 and 4 Pro's but no 5's. trying to buy a second hand one. I would think yes, but some drilling to expose bonds might be required.. or not depending on if chip maker needed nand exposed to pads or not.
In alot of MCP, some pads might be dual purpose.


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 Post subject: Re: Surface Pro 5 NAND Question
PostPosted: August 3rd, 2018, 12:15 
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Joined: June 11th, 2013, 17:01
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HaQue wrote:
usually call it a MCP, Multi chip package. Not sur exactly the terminology for these. as soon as I can get one I will start looking into it. I have multiple surface RT, 3 and 4 Pro's but no 5's. trying to buy a second hand one. I would think yes, but some drilling to expose bonds might be required.. or not depending on if chip maker needed nand exposed to pads or not.
In alot of MCP, some pads might be dual purpose.

May be the same as a Galaxy S5 and S6? They have UFS chips that sits on top of the controller. That chip can be read in a programmer as they are commercially available through Dediprog. If they are assembled the same, the NAND is soldered and glued to the bottom CPU, which is balled on both sides. If I get that far I will let you know.

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