Hello everyone!
This week, one of my clients gave me a WD Green SSD, model sn350. Two components located at the power input, a zener diode and a 6-pad BGA IC, had burned out. I assume that the IC had the function of waiting for the power to stabilize before activating the PMIC. I am attaching a photo of the board focused on the power input area after removing both the zener diode and the IC. For clarity, I have marked their positions with colored rectangles. The zener diode was in the yellow rectangle and the IC in the red one.
Using a multimeter, I measured the continuity between the two pads on the left of the IC, which I numbered as 1 and 2, with the top left end of the capacitor. The two center pads and the bottom left pad, numbered 3, 4, and 6, receive 3.3v directly from the input. The only pad I couldn't identify is number 6.
Since I don't have a donor to replace the burned components, I am thinking of joining pads 1 and 2 with pads 3 and 4 to solve the problem, but before doing so, I would like to consult whether it is a good idea.
I am also attaching a photo of the BGA IC. I tried to look up the codes written on the package on the Texas Instruments website (
https://www.ti.com/packaging/docs/partl ... sp#divline), but without success. The IC have 2 code parts written 17A6YCI and 28203.
Thanks very much and my best regards to all, thanks to read