Hello guys!

I want to start working with the PC3k Flash and i allready have experience with soldering. I never used a Preheat/ Rework station befor and i wanted to ask if someone have some experience to share? I am not shure what i need to notic when i want to buy one.. can someone recomand a company or a model?

Thank you!

Can't say I've ever had the need for anything other than simple hot air unit.

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Data Recovery Services in the UK.
https://www.usbrecovery.co.uk/

Preheat and hotair is always better than just hotair in my opinion. But for BGA it's recomended to use IR station.

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odzyskiwanie danych

melvin, Yes i guess both is better.. do you have any tipps for IR stations?

Well,
Lets debate on this ,You tell me why you think its necessary

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Regards
Amarbir S Dhillon , Chandigarh Data Recovery Labs [India]
Logical,Semi Physical And Physical Data Recovery
Website-> http://www.chandigarhdatarecovery.com

Well,
Hold on the horsie for a week ,watch this debate then decide

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Regards
Amarbir S Dhillon , Chandigarh Data Recovery Labs [India]
Logical,Semi Physical And Physical Data Recovery
Website-> http://www.chandigarhdatarecovery.com

Amarbir[CDR-Labs], okey, i will wait. I read online that its recomendet to use preheat to not damage or "heat shock" the NANDs.

There's nothing to debate. Chips just go off faster. Why? Because you heat solder through pcb, and not through the chip only.

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odzyskiwanie danych

If you're pull big BGA then ok but its not actually needed just for pull nand, you should be able to pull chips without thermal damage.

I'd also argue that a good hot air station is going to be more controllable, accurate and safer for the nand than a cheap IR bga rework station would be.

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Data Recovery Services in the UK.
https://www.usbrecovery.co.uk/

If we compare good hotair with crapy IR than you are right.
Even removing ROM is much faster with preheat. Especialy from Samsung and other with solder under the chip. Just test it.

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odzyskiwanie danych

+1 for preheat NAND, just to ensure minimum data loss. MCU without memory is a nother story.

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Digitalsupport Data Recovery
https://digitalsupport.dk

Better tools undoubtedly bring more advantages, that's unquestionable. However, they also require additional investment and occupy more workspace. Based on my experience in flash data recovery, for smaller circuit boards without large copper foils, they can be safely dismantled without preheating. Adding a preheating device at the bottom is beneficial when the environment temperature is too low or when there are large areas of copper foils with extensive soldering contact points on the circuit board. However, it's crucial to control the preheating time and temperature to prevent loss of electric charge within the flash memory cells, which could result in data loss. The most cost-effective setup would be a high-quality hot air station paired with an affordable preheating device.

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Auxiliary Tool Used For MonoLith Data Recovery, featuring the industry's most extensive Monolith pinouts
http://flash-matrix.com/

We don't use preheat or hot air with a TSOP. They are much more heat sensitive than BGA. We flood the legs with low melt solder and lift the chip off. Chip doesn't even get warm.

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HDD, SSD, Flash and RAID Data Recovery
Founder of The Data Recovery Professionals Group

Hey guys! A lot of experience.. I want to use the Preheat mostly for BGA. My hotair is a QUICK 861DW, works very well. But i think it would be better if i use a preheat + hotair to remove BGAs... so back to the toppic, can anyone recomand any preheat/rework stations? Or do you guys realy think its overreated?

Thank you guys.

Good afternoon
Preliminary (bottom) heating is required. This station will be enough for you.
853A Digital Preheat Soldering Station BGA Rework Station High Power 450w YIHUA
Regards
Andrey

one thing to consider:
https://forum.hddguru.com/viewtopic.php ... 64#p298164

It is always better to heat the board from the back side too, if possible (ie, no components on that side). This surely puts less stress on the component itself.
But you can't completely avoid direct heating (air or infra) by heating the board.

pepe

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Adatmentés - Data recovery

Then there is the frequent issue of NAND chips on both sides of the board.

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Luke
Recovery Force Data Recovery