TSOP Chip Off Cooling :D

[sin]

Hello Folks, i have just started my journey couple of months ago with Flash and luckily i was able to manage a Rusolut VNR starters Kit and suitable machine

Just had some pocket money from my dad (hehe at 31 I still get it) and devised a simple liquid cooling apparatus.

What you see in the pictures is a very crude and not so comfortable form, however, I think I will cad out a perfect apparatus for the same

Soldering iron with a spade type bit was used to remove the NAND.

I am sure such a setup wont work nicely with a BGA type...

In some papers people have experimented/worked out by sanding the opposite side of pcb till the BGA balls to avoid involvement of heat.
However I don't have such a jig and making one will be fun , risky and time consuming.


https://drive.google.com/file/d/17aCAw8 ... sp=sharing

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[Lardman]

Confused.... Is this for cooling the chips whilst removing them or whilst recovering the data from them.

[sin]

Hello there.
So far I am just using it to remove the chip.

Some creative ways can help with BGA packages too. Possibly trying to heat the flip side of the pcb while cooling the IC from top?

Perhaps for ever step. May be to reball aswell.

Wont know it, unless I do it.

Who knows?
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[Lardman]

Can't say I've ever had a problem with overheating tsops, I just run a little low melt over the pins and slide them off, doesn't need air most of the time.

[sin]

Yup no air required.
Hot air is way too damaging. First hand experience.

Liquid Cooling + soldering iron chip off worked nicely.
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