looks like they are going to do something with this technology

http://www.electronicsweekly.com/news/business/toshiba-breaks-ground-on-3d-nand-fab-2013-08/

Like Micron says.. gotta be commercially viable before they jump on board.. "jump on board" get it...come-on that was a good one..

Still working on a Samsung stacked chip SSD... one of the banks on one of the chips has few thousand bad bytes. Irritating... not sure how to improve reading of this one particular bank.

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Hard Disk Drive, SSD, USB Drive and RAID Data Recovery Specialist in Massachusetts

Probably not possible to do. if lower voltage doesn't work, power mods or whatever, then I guess that case is bust.

The Toshiba 3D is different to the stacked chips, it looks like the specs are a lot more relaxed, meaning not specced down to the utmost value, hopefully making it more reliable.

probably though someone will spec it right down and make it unreliable as what happens with most products.

NAND flash vendors gearing up for 3D chips
http://www.digitimes.com/news/a20130827PD200.html

Well looks like it is coming quicker than I really expected.



[quote]Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Tuesday 27 August 2013]
Samsung Electronics, Toshiba and Micron Technology have recently disclosed their 3D NAND flash memory developments. The vendors' 3D NAND chips are expected to be in early-stage production during 2014-2015, followed by the commercial production stage in later years, market sources believe.

However, Samsung's 3D NAND strategy and the market adoption of new end products employing 3D NAND chips will play the key factors to determine when the new technology is ready for commercial-scale production, according to the sources.

Samsung is currently ahead of rivals Toshiba and Micron in the development of 3D NAND flash memory. The Korea-based vendor claimed that it has begun mass producing 3D NAND chips for consumer electronics and enterprise applications such as embedded NAND storage and solid state drives (SSDs) in August 2013.

Samsung's new 12-inch fab in Xian, northwestern China reportedly will also accommodate the 3D NAND production. Samsung is set to run the new NAND flash fab sometime in 2014.

Toshiba recently broke ground for a new fab at its Yokkaichi operations, Japan, with the new capacity expected to come online in summer 2014. The facility will produce 3D NAND memory, as well as chips on more advanced node technologies.

Toshiba is expected to enter mass production of 3D NAND chips in 2015, industry sources have estimated. The Japan-based firm reportedly is delivering samples of 3D NAND already.

Micron CEO Mark Durcan revealed previously that the company would start providing samples of 3D NAND chips to customers in the first quarter of 2014.[quote]

There were a few more stories about new NAND linked there but I'm not Logging On or paying to read "news" of rumour and "industry believes". Industry cant believe anything, its freaking INDUSTRY. If you want me to believe, tell me Joe Bloggs of xyz Industries believes, or whatever.

Here is another site that looks pretty interesting. The URL caught my attention.

http://www.monolithic3d.com/blog.html
All these new and exciting terms:


BTW, who Doesn't want to go to a conference with a title like "SOI-3D-Subthreshold Microelectronics Technology Unified Conference"!

(not that I would understand much apart from the seat ticket)