Preheat Station?

[Ihab]

Hello guys!

I want to start working with the PC3k Flash and i allready have experience with soldering. I never used a Preheat/ Rework station befor and i wanted to ask if someone have some experience to share? I am not shure what i need to notic when i want to buy one.. can someone recomand a company or a model?

Thank you!

[Lardman]

Can't say I've ever had the need for anything other than simple hot air unit.

[melvin]

Preheat and hotair is always better than just hotair in my opinion. But for BGA it's recomended to use IR station.

[Ihab]

melvin, Yes i guess both is better.. do you have any tipps for IR stations?

[Amarbir[CDR-Labs]]

Preheat and hotair is always better than just hotair in my opinion. But for BGA it's recomended to use IR station.

Well,
Lets debate on this ,You tell me why you think its necessary

[Amarbir[CDR-Labs]]

melvin, Yes i guess both is better.. do you have any tipps for IR stations?

Well,
Hold on the horsie for a week ,watch this debate then decide

[Ihab]

Amarbir[CDR-Labs], okey, i will wait. I read online that its recomendet to use preheat to not damage or "heat shock" the NANDs.

[melvin]

There's nothing to debate. Chips just go off faster. Why? Because you heat solder through pcb, and not through the chip only.

[Lardman]

There's nothing to debate. Chips just go off faster. Why? Because you heat solder through pcb, and not through the chip only.

If you're pull big BGA then ok but its not actually needed just for pull nand, you should be able to pull chips without thermal damage.

I'd also argue that a good hot air station is going to be more controllable, accurate and safer for the nand than a cheap IR bga rework station would be.

[melvin]

If we compare good hotair with crapy IR than you are right.
Even removing ROM is much faster with preheat. Especialy from Samsung and other with solder under the chip. Just test it.

[digisupport]

+1 for preheat NAND, just to ensure minimum data loss. MCU without memory is a nother story.

[csava]

Better tools undoubtedly bring more advantages, that's unquestionable. However, they also require additional investment and occupy more workspace. Based on my experience in flash data recovery, for smaller circuit boards without large copper foils, they can be safely dismantled without preheating. Adding a preheating device at the bottom is beneficial when the environment temperature is too low or when there are large areas of copper foils with extensive soldering contact points on the circuit board. However, it's crucial to control the preheating time and temperature to prevent loss of electric charge within the flash memory cells, which could result in data loss. The most cost-effective setup would be a high-quality hot air station paired with an affordable preheating device.

[ddrecovery]

We don't use preheat or hot air with a TSOP. They are much more heat sensitive than BGA. We flood the legs with low melt solder and lift the chip off. Chip doesn't even get warm.

[Ihab]

Hey guys! A lot of experience.. I want to use the Preheat mostly for BGA. My hotair is a QUICK 861DW, works very well. But i think it would be better if i use a preheat + hotair to remove BGAs... so back to the toppic, can anyone recomand any preheat/rework stations? Or do you guys realy think its overreated?

Thank you guys.

[gold6565]

Hello guys!

I want to start working with the PC3k Flash and i allready have experience with soldering. I never used a Preheat/ Rework station befor and i wanted to ask if someone have some experience to share? I am not shure what i need to notic when i want to buy one.. can someone recomand a company or a model?

Thank you!

Good afternoon
Preliminary (bottom) heating is required. This station will be enough for you.
853A Digital Preheat Soldering Station BGA Rework Station High Power 450w YIHUA
Regards
Andrey

[pepe]

one thing to consider:
https://forum.hddguru.com/viewtopic.php ... 64#p298164

It is always better to heat the board from the back side too, if possible (ie, no components on that side). This surely puts less stress on the component itself.
But you can't completely avoid direct heating (air or infra) by heating the board.

pepe

[crashpcberlin]

Can't say I've ever had the need for anything other than simple hot air unit.

https://support.rusolut.com/portal/en/k ... nsoldering

[lcoughey]

Then there is the frequent issue of NAND chips on both sides of the board.