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| Surface Pro 5 NAND Question http://forum.hddguru.com/viewtopic.php?f=10&t=37192 |
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| Author: | ddrecovery [ August 1st, 2018, 20:15 ] | ||
| Post subject: | Surface Pro 5 NAND Question | ||
Anyone tried a chip off on a Surface Pro 5, or know if its even worth it? I have attached a picture of the chip and the space for an additional chip which details the pinout. This chip is also PCIe. I am hoping this is an obvious mobo issue so we can extract the data that way, but we will see.
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| Author: | HaQue [ August 1st, 2018, 21:47 ] |
| Post subject: | Re: Surface Pro 5 NAND Question |
Hi, you should search forum mate!!  http://forum.hddguru.com/viewtopic.php?f=10&t=37085 |
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| Author: | fzabkar [ August 3rd, 2018, 2:01 ] |
| Post subject: | Re: Surface Pro 5 NAND Question |
There are 2 date codes and 2 part numbers on that chip. Is it a "stacked" device? That is, would it be possible to separate the NAND from the controller???
KUS020203M-B000 -- week 19, 2017 -- controller (SSD) ??? |
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| Author: | HaQue [ August 3rd, 2018, 2:56 ] |
| Post subject: | Re: Surface Pro 5 NAND Question |
usually call it a MCP, Multi chip package. Not sur exactly the terminology for these. as soon as I can get one I will start looking into it. I have multiple surface RT, 3 and 4 Pro's but no 5's. trying to buy a second hand one. I would think yes, but some drilling to expose bonds might be required.. or not depending on if chip maker needed nand exposed to pads or not. In alot of MCP, some pads might be dual purpose. |
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| Author: | ddrecovery [ August 3rd, 2018, 12:15 ] |
| Post subject: | Re: Surface Pro 5 NAND Question |
HaQue wrote: usually call it a MCP, Multi chip package. Not sur exactly the terminology for these. as soon as I can get one I will start looking into it. I have multiple surface RT, 3 and 4 Pro's but no 5's. trying to buy a second hand one. I would think yes, but some drilling to expose bonds might be required.. or not depending on if chip maker needed nand exposed to pads or not. In alot of MCP, some pads might be dual purpose. May be the same as a Galaxy S5 and S6? They have UFS chips that sits on top of the controller. That chip can be read in a programmer as they are commercially available through Dediprog. If they are assembled the same, the NAND is soldered and glued to the bottom CPU, which is balled on both sides. If I get that far I will let you know. |
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