Based on the information you provided, I have made the following judgment:
According to the marking 8A1B 64GB, the chip ID is AD7E285302B0
This is a short-type 3.0 UFD, and judging by its appearance, it is highly likely to use a 4-layer PCB, which causes other wires to be hidden underneath.
The crystal marked 8A1B has a slim rectangular shape. I suspect its layout is as shown in the diagram below.
You should damage the PCB from the left side, going all the way down to the bottommost layer of the PCB. There, you will see the bonding die PADs, which you can connect to a logic analyzer using wires. However, I believe you are likely to fail, as this kind of work requires a high level of skill and expertise.
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