fzabkar wrote:
Download the ONFI NAND spec and obtain the pinout for TSOP-48 and BGA-132 NANDs. Then locate the pin and ball that connect to DQ1. Test for continuity between the pin and ball.
http://www.onfi.org/-/media/client/onfi/specs/onfi_4_1_gold.pdf?la=enThanks ,
This is Well Worth The Read ,This is there in PC3K Flash Documentation Section also ,I also happened to go to this website but never sat and read well ,Focus is on this
"Figure 14 defines the ball assignments for devices using 152-ball BGA packaging with dual 8-bit
data access. Figure 15 defines the ball assignments for devices using 132-ball BGA packaging
with dual 8-bit data access. Figure 16 defines the ball spacing requirements for the 152-ball and
132-ball BGA package. There are two package sizes: 12mm x 18mm (132-ball) and 14mm x
18mm (152-ball) and two solder ball diameter sizes: 0.45±0.05mm and 0.55±0.05mm post reflow
for both package sizes. Note: If the 12mm x 18mm package size is used, then outer columns
are not present and the package is a 132-ball BGA. For the 132-ball BGA, the columns are re-
enumerated to begin at column 1 (i.e. BGA-152 column 2 becomes BGA-132 column 1).
Depending on the data interface selected, balls may have different usages and/or meanings.
Refer to for the specific use for each ball in each data interface. "
A Interesting thing i learned was that 18x12mm is BGA132 and 18x14 is BGA152 and i always thought both have same sized balls
![Mr. Green :mrgreen:](./images/smilies/icon_mrgreen.gif)
, Now i know one is 0.45mm and the other is 0.55mm .I will definitely trace this and revert back thanks a tonn
![Cool 8)](./images/smilies/icon_cool.gif)
PS : Size of BGA132 and BGA152 is always difference but i never knew the dimensions
_________________
Regards
Amarbir S Dhillon , Chandigarh Data Recovery Labs [India]
Logical,Semi Physical And Physical Data Recovery
Website->
http://www.chandigarhdatarecovery.com